Mechanical Analysis of Electronic Packaging Systems

Explore the intricate world of electronic packaging with "Mechanical Analysis of Electronic Packaging Systems" by Mckeown, published by Taylor & Francis Ltd in 2019. This comprehensive paperback, spanning 376 pages, bridges the gap between traditional engineering texts and advanced software guides. Mckeown offers a pragmatic and common-sense approach to tackling electronic packaging configuration challenges. By combining classical engineering techniques with modern computational methods, this book equips readers with the tools necessary for optimal assessment in terms of cost and accuracy. Ideal for mechanical engineers and professionals in the field, this resource is essential for anyone looking to enhance their understanding of electronic packaging systems.