Electromigration in Metals

Discover the intricate world of electromigration with Electromigration in Metals by Paul Ho, published by Cambridge University Press in 2022. This comprehensive hardback spans 430 pages and serves as an essential resource for understanding and assessing electromigration reliability in semiconductor devices.

From fundamental physics to advanced methodologies, this book equips readers with the knowledge to design more resilient chips and develop highly reliable on-chip wiring stacks and power grids. Whether you're a materials scientist or a chip design engineer, this text provides valuable insights and practical approaches to enhance the durability of your electronic components. Don't miss the opportunity to elevate your expertise in this critical field!