3D Integration in VLSI Circuits

Discover the cutting-edge world of 3D integration with 3D Integration in VLSI Circuits by Katsuyuki Sakuma. Published by Taylor & Francis Ltd in 2021, this insightful paperback spans 234 pages, providing a comprehensive overview of contemporary challenges and advancements in 3D integration technologies.

Delve into various integration methods, including 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D integration. This book is an essential resource for engineers and researchers looking to enhance their understanding of VLSI circuits and the future of semiconductor technology. Equip yourself with the knowledge to navigate the complexities of 3D integration and stay ahead in this rapidly evolving field.