• Book cover of: 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility. By: Lih-Tyng Hwang

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Lih-Tyng Hwang

€140,59
€140,59 €144,94 Izpārdošana

Mums ir noliktavā

📦 Šios prekės gali nebūti sandėlyje.
Prieš perkant parašykite mums, kad patikslintume: info@bookshop.lt 💜

Autorius Lih-Tyng Hwang
Leidimo metai 2018 m.
Puslapių skč. 464 psl.
Viršelis Kietas viršelis
ISBN 9781119289647

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang, Tzyy-Sheng Jason Horng.

Published by Wiley & Sons, Incorporated, John, (2018), Hardback, 464 pages.

Topics: Mobile communication systems.

Book cover of: 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility. By: Lih-Tyng Hwang

3D IC and RF SiPs: Advanced Stacking ...

€140,59
€140,59 €144,94