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Cietajos vākosMichael (University of Maryland, College Park, USA) PechtElectronic Packaging Materials and Their Properties €233,73€234,99 Piegāde 3-4 nedēļāsPaziņot
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Mīkstajos vākosSandip BhattacharyaNano-Interconnect Materials and Models for Next Generation Integrated Circuit Design €74,17 Piegāde 3-4 nedēļāsPaziņot
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