• Book cover of: 3D Interconnect Architectures for Heterogeneous Technologies. By: Lennart Bamberg

3D Interconnect Architectures for Heterogeneous Technologies

Lennart Bamberg

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Autorius Lennart Bamberg
Kalba Anglų k.
Žanras Engineering
Leidimo metai 2022 m.
Puslapių skč. 395 psl.
Viršelis Kietas viršelis
ISBN 9783030982287
Leidimas 2022 ed.

3D Interconnect Architectures for Heterogeneous Technologies

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.

Book cover of: 3D Interconnect Architectures for Heterogeneous Technologies. By: Lennart Bamberg

3D Interconnect Architectures for Het...

€134,37
€134,37 €138,99