{"product_id":"through-silicon-vias-for-3d-integration-mcgraw-hill-education-europe-9780071785143","title":"Through-Silicon Vias for 3D Integration","description":"\u003cp\u003eExplore the cutting-edge world of electronic engineering with \"Through-Silicon Vias for 3D Integration,\" authored by leading experts and published by McGraw-Hill Education - Europe in 2012. This comprehensive hardback, spanning 512 pages, delves into innovative techniques that enhance the design and manufacturing of 3D integrated circuits. As technology advances, the demand for cost-effective and space-efficient solutions becomes paramount, and this book addresses these challenges head-on. Whether you are a seasoned professional or an enthusiastic learner, this resource is invaluable for understanding the intricacies of electronic and optoelectronic product development. Discover how through-silicon vias can significantly contribute to the creation of low-cost, high-performance devices, making it an essential addition to your technical library.\u003c\/p\u003e","brand":"Bookshop","offers":[{"title":"Default Title","offer_id":52226459992406,"sku":"9780071785143","price":195.2,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9780071785143.jpg?v=1767740082","url":"https:\/\/www.bookshop.lv\/products\/through-silicon-vias-for-3d-integration-mcgraw-hill-education-europe-9780071785143","provider":"Bookshop","version":"1.0","type":"link"}