{"product_id":"3d-interconnect-architectures-for-heterogeneous-technologies-springer-nature-switzerland-ag-9783030982287-modeling-and-optimization-lennart-bamberg","title":"3D Interconnect Architectures for Heterogeneous Technologies","description":"\u003cp\u003eThis book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.\u003c\/p\u003e","brand":"Lennart Bamberg","offers":[{"title":"Default Title","offer_id":52281100403030,"sku":"9783030982287","price":133.37,"currency_code":"EUR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0886\/3206\/6390\/files\/9783030982287.jpg?v=1767826966","url":"https:\/\/www.bookshop.lv\/products\/3d-interconnect-architectures-for-heterogeneous-technologies-springer-nature-switzerland-ag-9783030982287-modeling-and-optimization-lennart-bamberg","provider":"Bookshop","version":"1.0","type":"link"}